Curing time: the shortest time from when the glue is pressed between the two substrates until a firm bond is formed. Holding time should not less than curing time can be good.

Heat resistance: The maximum temperature that the bonding system can withstand without the bond being damaged.

Cohesion: A microscopic statement of the strength of the material itself, which is similar to tensile strength.

Thermal stability: the ability of the material to withstand high temperatures for a long time.

Anti-aging: refers to the degree of change in the bonding strength or tack of the bonding system with time during storage at room temperature.

Glass transition temperature: The temperature at which a polymer material changes from a rubbery state to a plastic state. Each hot melt adhesive is specific

If the glass transition temperature is lower than the glass transition temperature, the hot melt adhesive will lose its toughness and viscosity.

Low temperature resistance: The ability of hot melt adhesives to maintain good bonding strength or tack at low temperatures.

Transfer: Also known as residual, refers to the adhesive remaining on the substrate after the pressure-sensitive adhesive is torn off from the substrate.

Wire drawing: refers to the filament that appears at the end of the hot melt adhesive when the hot melt adhesive is sprayed from the nozzle to the substrate.

The properties, spray temperature and nozzle performance are related.